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Grain Size
During the sintering process, diamond grains begin to grow together into a matrix structure. The properties of the PCD material can be manipulated by changing the size of the diamond powder before sintering. Surface finish of the wire
and life of the die vary the most with changes in grain size.
Small Grain Size
- Less likely to crack
- Leave a bright finish on wire
- Higher Toughness
Large Grain Size
- Extend life of Die
- Leave a matted finish on wire